Magnalytix: Electronics Reliability Solutions

MGX B-52 Legacy 2

The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.

MGX BGA 10

MGX BGA 10 SIR test board is effective at evaluating multi-chip modules and processing chips. The BGA platform enables chip makers to characterize solder pastes, low temperature solders, and underfills.

MGX B-53 Type I

The MGX B-53 Type I test board contains No-Solder Mask. The four combs have varying pitch: Channel A has 500 µms spacing – Channel B has 400 µms spacing – Channel C has 320 µms spacing and Channel D has 200 µms spacing. As the pitch tightens, process residues left behind can be more problematic.

MGX B-53 Type II

The MGX B-53 Type II test board is a Solder Mask Defined board. The four combs have varying pitch. Channel A has 500 µms spacing – Channel B has 400 µms spacing – Channel C has 320 µms spacing and Channel D has 200 µms spacing. A solder mask defined test board provides insulation between the comb patterns. This insulation provides a degree of protection from process residues.

MGX B-53 Type III

The MGX B-53 Type III test board is a Solder Mask Defined board with Solder Mask over the SIR Comb patterns. This board is designed to use the Solder Mask specific to your designs. The board design evaluates insulation resistance of the Solder Mask place over circuit traces.

MGX 20 Pin Header

The MGX 20 Pin Header test board is designed to test both wave solder and selective solder processes. Each quadrant has a change in pitch from 1 mm/1.27 mm/2 mm/2.54 mm. The reduction in pitch allows the assembler to dial in their selective soldering and wave soldering processes on highly dense component geometries. This board is also capable of doing paste in-hole.

MGX B-24 Type I

The MGX B-24 Type I test board is representative of the IPC B-24 test board design to characterize solder materials and cleanliness. The test patterns are exposed to an accelerating test environment of temperature and humidity under bias to measure Surface Insulation Resistance (SIR Leakage Currents) between two metal electrodes.

MGX QFP 48-11 4-Up Panel

The MGX QFP 48-11 4-Up Panel test set is designed to test SMT Top Side, SMT Bottom Side and Selective Soldering processes. Quadrant 1 is designed to test the QFN components on the top side of the board. Quadrant 2 is designed to test the QFN components on the back side of the board. Quadrant 3 is designed to test the SMT connector and 0805 caps on the top side of the board. Quadrant 4 is designed to test the TH pins and 0805 caps on the bottom side of the board. This multifunctional test board is ideal for evaluating No-Clean and Cleaning processes.

MGX QMP Type A

The electronics industry is rapidly embracing the IPC J-STD-001 cleanliness standard. SIR testing is the preferred method for qualified manufacturing plan certification. This standard has just begun to impact electronics manufacturers as design and production teams work through compliance with their design authority.

MGX QMP Type B

MGX QMP Type C

MGX B-52 Legacy 1

The MGX B-52 Legacy 1 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. One of the unique features of these test boards is the QFP 160 and QFP 80 SIR comb patterns placed underneath these components. These combs allow the assembler to detect bath loading and rinse issues within the cleaning process.

MGX B-52 Legacy 3

The MGX B-52 Legacy 3 test board is designed to detect inadequate rinsing and aged wash chemistry when cleaning production assemblies. The QFP 80 and QFP 160 in Quadrants 3 and 4 have SIR comb patterns located under the component termination.

MGX B-52 Legacy 4

The MGX B-52 Legacy 4 test board is excellent for evaluating the design margin represented on assemblies populated with bottom terminated components. The QFN designs incorporate large thermal lugs, which can underfill the bottom termination with flux residue.

MGX Connector 10

MGX Connector 10 SIR test board allows an assembler to evaluate multiple soldering steps on surface mount caps on the top and bottom side with a high-density SMT/TH connector. The MGX Connector 10 allows an assembler to test no-clean processing across multiple soldering steps including Surface Mount, Thru-Hole and Rework.

MGX QFN 10

The MGX QFN 10 SIR test board is designed to evaluate printed circuit board design features to improve outgassing under bottom terminated components. Bottom terminated components have notoriously low standoff gaps.

MGX QFN-11

The MGX QFN 11 SIR test board reduces signal pin pitch over the four quadrants. As the signal pin distance between opposite conductors narrows, the potential for current leakage increases. The tighter pitch equates to increases in the cubic volume of flux residue.

9-8-7-6 Validation Card

The MGX 9/8/7/6 system validation board is populated with four known value resistors. Its purpose to confirm or 'validate' that the system is reading the proper resistance values prior to commencing a new test. This card is designed to run at ambient conditions and is recommended for use prior to the beginning of an SIR test protocol. The system software includes a software checklist/protocol to quickly validate the system, as well as record and report the results along with SIR test that commences after the validation test. Some clients elect to run the test both before and after a SIR protocol.

MGX B-54 Type I

The MGX B-54 Type I test board – similar in design to the IPC B-25A test board. MGX B-54 Type I is used to evaluate interactions between solder masks, solder pastes, and solder fluxes. MGX B-54 Type I is functional at testing the current requirements for Conformal Coatings (IPC-CC-830A).

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