MGX B-52 Legacy 1
MGX B-52 Legacy 1
Description
The MGX B-52 Legacy 1 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. One of the unique features of these test boards is the QFP 160 and QFP 80 SIR comb patterns placed underneath these components. These combs allow the assembler to detect bath loading and rinse issues within the cleaning process.
Uses
Cleaning under Bottom Terminated Components
Risk of Partially Cleaned Flux Residue
Rinsing Effectiveness (Wash Fluid Entrapment)
Wash Fluid Bath Life
Conformal Coating Characterization
Pitch
Components
MGX QFN 48 Chip
MGX QFN 48 has a smaller thermal lug of 4 mm squared designed to define cleanliness levels under similar package styles.
MGX BGA 244 Chip
With a center lug, MGX BGA 244 has a high standoff gap and easier to clean. This component tends to be representative of the BGA family of components. The center lug adds some degree of complexity by obstructing flow channels.
MGX QFP 80 Chip
MGX QFP 80 is a challenging component due to the 0.65 mm pitch and large pad size of 0.45 mm by 1.8 mm and SIR comb under the component termination. Unlike the leaded component, the lands are screen printed around the peripheral of the part. These components are excellent for detecting cleaning and rinsing issues.
MGX QFP 160 Chip
MGX QFP 160 is a challenging component due to the 0.65 mm pitch and large pad size of 0.45 mm by 2 mm and SIR comb under the component termination. Unlike the leaded component, the lands are screen printed around the peripheral of the part. These components are excellent for detecting cleaning and rinsing issues.