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  7. MGX BGA 244 Chip

MGX BGA 244 Chip (Back View)
MGX BGA 244 Chip (Back View)
MGX BGA 244 Chip (Front View)

MGX BGA 244 Chip

Description

With a center lug, MGX BGA 244 has a high standoff gap and easier to clean. This component tends to be representative of the BGA family of components. The center lug adds some degree of complexity by obstructing flow channels.


Details

244-Leads, Body 19×19 mm, Pitch 1 mm



Compatible Test Cards
MGX B-52 Legacy 2

MGX B-52 Legacy 2

The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.

MGX B-52 Legacy 1

MGX B-52 Legacy 1

The MGX B-52 Legacy 1 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. One of the unique features of these test boards is the QFP 160 and QFP 80 SIR comb patterns placed underneath these components. These combs allow the assembler to detect bath loading and rinse issues within the cleaning process.

MGX B-52 Legacy 3

MGX B-52 Legacy 3

The MGX B-52 Legacy 3 test board is designed to detect inadequate rinsing and aged wash chemistry when cleaning production assemblies. The QFP 80 and QFP 160 in Quadrants 3 and 4 have SIR comb patterns located under the component termination.

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