MGX Mixed Technology SIR Test Board
MGX Mixed Technology SIR Test Board
Description
The MGX Mixed Technology SIR Test Board is a purpose built Surface Insulation Resistance (SIR) and electrochemical reliability test platform designed to evaluate flux behavior, cleaning effectiveness, and process robustness across a range of component geometries. Combining fine-pitch, bottom-terminated, through-hole, and passive components on a single standardized board enables comprehensive cleanliness and reliability characterization aligned with J-STD-001 Section 8 requirements.
In Stock • Ready for Shipment
Uses
Double-Sided Mixed Technology
Cleaning under Bottom Terminated Components
Cleaning under QFNs
High Complexity Test Board (LGA, 0.4 mm Pitch BGA)
Selective Soldering
Rinsing Effectiveness (Wash Fluid Entrapment)
Risk of Partially Cleaned Flux Residue
Solder Flux Characterization
Solder Paste Characterization
Activity of Flux Residue
No-Clean Soldering
Surface Mount Technology
Wash Fluid Bath Life
Components
0402/10 PF-480 PF Capacitor Chip
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
0603/10 PF-480 PF Capacitor Chip
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
0805/10 PF-480 PF Capacitor Chip
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
MGX BGA 244 Chip
With a center lug, MGX BGA 244 has a high standoff gap and easier to clean. This component tends to be representative of the BGA family of components. The center lug adds some degree of complexity by obstructing flow channels.
QFN 48-11 SIR Glass Chiplet
The SIR Glass QFN-48 component is a 48-lead, glass-substrate QFN package. It is designed specifically for visual flux residue inspection, cleaning process characterization, and surface insulation resistance (SIR) testing. Enabling controlled evaluation of electrochemical cleanliness, flux behavior, and process reliability in accordance with the requirements of J-STD-001 Section 8.
MGX QFN 48-11 Chip
MGX QFN 48-11 Chip is one of the more challenging components to clean with a standoff gap lower than 50μms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.