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MGX QFN 48-11 Chip (Back)
MGX QFN 48-11 Chip (Back)
MGX QFN 48-11 Chip (Front)

MGX QFN 48-11 Chip

Description

MGX QFN 48-11 Chip is one of the more challenging components to clean with a standoff gap lower than 50μms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.


Details

48-Leads, Body 7.25×7.25 mm, Pitch 0.5 mm



Compatible Test Cards
MGX QFN-11

MGX QFN-11

The MGX QFN 11 SIR test board reduces signal pin pitch over the four quadrants. As the signal pin distance between opposite conductors narrows, the potential for current leakage increases. The tighter pitch equates to increases in the cubic volume of flux residue.

MGX Mixed Technology SIR Test Board

MGX Mixed Technology SIR Test Board

The MGX Mixed Technology SIR Test Board is a purpose built Surface Insulation Resistance (SIR) and electrochemical reliability test platform designed to evaluate flux behavior, cleaning effectiveness, and process robustness across a range of component geometries. Combining fine-pitch, bottom-terminated, through-hole, and passive components on a single standardized board enables comprehensive cleanliness and reliability characterization aligned with J-STD-001 Section 8 requirements.

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