Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
0.080”L x 0.050”W (2.00 mm x 1.25 mm)
The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.
The MGX Mixed Technology SIR Test Board is a purpose built Surface Insulation Resistance (SIR) and electrochemical reliability test platform designed to evaluate flux behavior, cleaning effectiveness, and process robustness across a range of component geometries. Combining fine-pitch, bottom-terminated, through-hole, and passive components on a single standardized board enables comprehensive cleanliness and reliability characterization aligned with J-STD-001 Section 8 requirements.