MGX B-52 Legacy 2
MGX B-52 Legacy 2
Description
The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.
In Stock • Ready for Shipment
Uses
Solder Paste Characterization
Activity of Flux Residue
No-Clean Soldering
Cleaning under Bottom Terminated Components
Risk of Partially Cleaned Flux Residue
Rinsing Effectiveness (Wash Fluid Entrapment)
Wash Fluid Bath Life
Rework
Conformal Coating Characterization
Components
MGX QFN 48-1 Chip
MGX QFN 48-1 Chip is one of the more challenging components to clean with a standoff gap lower than 50µms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.
MGX BGA 244 Chip
With a center lug, MGX BGA 244 has a high standoff gap and easier to clean. This component tends to be representative of the BGA family of components. The center lug adds some degree of complexity by obstructing flow channels.
MGX QFP 160-1 Chip
MGX QFP 160-1 is representative of the leaded QFN 80 components with smaller pad size of 0.3 mm by 1.0 mm and SIR comb under the component termination. This component is designed to detect cleaning and rinsing issues.
0402/10 PF-480 PF Capacitor Chip
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
0603/10 PF-480 PF Capacitor Chip
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
0805/10 PF-480 PF Capacitor Chip
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The tighter pitch in combination with the low standoff can underfill and block outgassing channels. The caps are excellent for characterizing both clean and no-clean process residues under similar component styles.
0201/10 PF-480 PF Capacitor Chip
Is a miniaturized cap with a very tight pitch between the conductors of opposite polarity. Flux often bridges the conductive paths, but this component is good for both clean and no-clean process residues.