MGX QFP 160-1 Chip (Back View)
MGX QFP 160-1 Chip (Back View)
MGX QFP 160-1 Chip (Front View)

MGX QFP 160-1 Chip

Description

MGX QFP 160-1 is representative of the leaded QFN 80 components with smaller pad size of 0.3 mm by 1.0 mm and SIR comb under the component termination. This component is designed to detect cleaning and rinsing issues.

Details

160-Leads, Body 31.8×31.8 mm, Pitch 0.65 mm

Compatible Test Cards
MGX B-52 Legacy 2

MGX B-52 Legacy 2

The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.

MGX B-52 Legacy 3

MGX B-52 Legacy 3

The MGX B-52 Legacy 3 test board is designed to detect inadequate rinsing and aged wash chemistry when cleaning production assemblies. The QFP 80 and QFP 160 in Quadrants 3 and 4 have SIR comb patterns located under the component termination.