MGX B-52 Legacy 3
Uses
Solder Paste Characterization
Activity of Flux Residue
Cleaning under Bottom Terminated Components
Risk of Partially Cleaned Flux Residue
Rinsing Effectiveness (Wash Fluid Entrapment)
Wash Fluid Bath Life
Conformal Coating Characterization
Components
MGX QFN 48-1 Chip
MGX QFN 48-1 Chip is one of the more challenging components to clean with a standoff gap lower than 50µms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.
MGX BGA 244 Chip
With a center lug, MGX BGA 244 has a high standoff gap and easier to clean. This component tends to be representative of the BGA family of components. The center lug adds some degree of complexity by obstructing flow channels.
MGX QFP 80-1 Chip
MGX QFP 80-1 is representative of the leaded QFN 80 components with smaller pad size of 0.25 mm by 1.0 mm and SIR comb under the component termination. This component is designed to detect cleaning and rinsing issues.
MGX QFP 160-1 Chip
MGX QFP 160-1 is representative of the leaded QFN 80 components with smaller pad size of 0.3 mm by 1.0 mm and SIR comb under the component termination. This component is designed to detect cleaning and rinsing issues.