The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.
The MGX B-52 Legacy 3 test board is designed to detect inadequate rinsing and aged wash chemistry when cleaning production assemblies. The QFP 80 and QFP 160 in Quadrants 3 and 4 have SIR comb patterns located under the component termination.
The MGX B-52 Legacy 4 test board is excellent for evaluating the design margin represented on assemblies populated with bottom terminated components. The QFN designs incorporate large thermal lugs, which can underfill the bottom termination with flux residue.
The MGX QFN 10 SIR test board is designed to evaluate printed circuit board design features to improve outgassing under bottom terminated components. Bottom terminated components have notoriously low standoff gaps.
