MGX QFN 10


MGX QFN 10
MGX QFN 10
MGX QFN 10 Video

MGX QFN 10

Description

The MGX QFN 10 SIR test board is designed to evaluate printed circuit board design features to improve outgassing under bottom terminated components. Bottom terminated components have notoriously low standoff gaps.

Uses

Solder Paste Characterization

Activity of Flux Residue

No-Clean Soldering

Cleaning under QFNs

Components

MGX QFN 48-1 Chip (Back View)

MGX QFN 48-1 Chip

MGX QFN 48-1 Chip is one of the more challenging components to clean with a standoff gap lower than 50µms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.