MGX QFP 80 Chip (Back View)
MGX QFP 80 Chip (Back View)
MGX QFP 80 Chip (Front View)

MGX QFP 80 Chip

Description

MGX QFP 80 is a challenging component due to the 0.65 mm pitch and large pad size of 0.45 mm by 1.8 mm and SIR comb under the component termination. Unlike the leaded component, the lands are screen printed around the peripheral of the part. These components are excellent for detecting cleaning and rinsing issues.

Details

80-Leads, Body 18.3×18.3 mm, Pitch 0.65 mm

Compatible Test Cards
MGX B-52 Legacy 1

MGX B-52 Legacy 1

The MGX B-52 Legacy 1 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. One of the unique features of these test boards is the QFP 160 and QFP 80 SIR comb patterns placed underneath these components. These combs allow the assembler to detect bath loading and rinse issues within the cleaning process.