MGX BGA 10


MGX BGA 10
MGX BGA 10
MGX BGA 10 Video

MGX BGA 10

Description

MGX BGA 10 SIR test board is effective at evaluating multi-chip modules and processing chips. The BGA platform enables chip makers to characterize solder pastes, low temperature solders, and underfills.

In Stock • Ready for Shipment

Uses

Surface Mount Technology

Activity of Flux Residue

No-Clean Soldering

Cleaning under Bottom Terminated Components

Rework

Cleaning under QFNs

Components

MGX BGA 256 Chip (Back View)

MGX BGA 256 Chip

MGX BGA 256 is a 256 I/O array designed to be used for both BGA and LGA component designs. The 256 I/O is optimal for defining cleanliness levels under similar package styles.

MGX BGA 572 Chip (Back View)

MGX BGA 572 Chip

MGX BGA 572 is a 572 I/O array designed to be used for both BGA and LGA component designs. By increasing the I/O to 572, the residue set will be a more rigorous test for both clean and no-clean designs.

MGX BGA 1020 Chip (Back View)

MGX BGA 1020 Chip

MGX BGA 1020 is a 1020 I/O array designed to be used for both BGA and LGA component designs. As the I/O increases to 1020, the package presents a greater challenge for both clean and no-clean designs.

MGX BGA 1932 Chip (Back View)

MGX BGA 1932 Chip

MGX BGA 1932 is a 1932 I/O array designed to be used for both BGA and LGA component designs. As the I/O increases to 1932, the challenge for both clean and no-clean widens making for a worst-case condition.