MGX BGA 10
MGX BGA 10 SIR test board is effective at evaluating multi-chip modules and processing chips. The BGA platform enables chip makers to characterize solder pastes, low temperature solders, and underfills.
MGX BGA 256 Chip
Description
MGX BGA 256 is a 256 I/O array designed to be used for both BGA and LGA component designs. The 256 I/O is optimal for defining cleanliness levels under similar package styles.
Details
256-Leads, Body 17×17 mm, Pitch 1mm