MGX QMP Type C
MGX QMP Type C
Description
The electronics industry is rapidly embracing the IPC J-STD-001 cleanliness standard. SIR testing is the preferred method for qualified manufacturing plan certification. This standard has just begun to impact electronics manufacturers as design and production teams work through compliance with their design authority.
In Stock • Ready for Shipment
Uses
Solder Paste Characterization
Activity of Flux Residue
No-Clean Soldering
Cleaning under Bottom Terminated Components
Risk of Partially Cleaned Flux Residue
Rinsing Effectiveness (Wash Fluid Entrapment)
Wash Fluid Bath Life
Conformal Coating Characterization
8 Channel Test Board
High Complexity Test Board (LGA, 0.4 mm Pitch BGA)
Components
MGX QFN 48 Chip
MGX QFN 48 has a smaller thermal lug of 4 mm squared designed to define cleanliness levels under similar package styles.
0508/10 PF-480 PF Capacitor Array Chip
Is a miniaturized cap with a very tight pitch between the conductors of opposite polarity. This design tests for fluid that can be trapped in the body of the component located under an RF Shield.