MGX QMP Type B


MGX QMP Type B (Top)
MGX QMP Type B (Top)
MGX QMP Type B (Bottom)

MGX QMP Type B

Description

The electronics industry is rapidly embracing the IPC J-STD-001 cleanliness standard. SIR testing is the preferred method for qualified manufacturing plan certification. This standard has just begun to impact electronics manufacturers as design and production teams work through compliance with their design authority.

In Stock • Ready for Shipment

Uses

Surface Mount Technology

Solder Paste Characterization

Activity of Flux Residue

No-Clean Soldering

Cleaning under Bottom Terminated Components

Risk of Partially Cleaned Flux Residue

Rinsing Effectiveness (Wash Fluid Entrapment)

Wash Fluid Bath Life

Rework

Conformal Coating Characterization

8 Channel Test Board

Components

MGX QFN 48 Chip (Back View)

MGX QFN 48 Chip

MGX QFN 48 has a smaller thermal lug of 4 mm squared designed to define cleanliness levels under similar package styles.