MGX B-53 Type I
MGX B-53 Type I

MGX B-53 Type I

Description

The MGX B-53 Type I test board contains No-Solder Mask. The four combs have varying pitch: Channel A has 500 µms spacing – Channel B has 400 µms spacing – Channel C has 320 µms spacing and Channel D has 200 µms spacing. As the pitch tightens, process residues left behind can be more problematic.

In Stock • Ready for Shipment

Uses

Solder Paste Characterization

No Solder Mask

Standard Finish Options (ENIG, OSP over Copper)