MGX QFN 10


MGX QFN 10
MGX QFN 10

MGX QFN 10

Description

The MGX QFN 10 SIR test board is designed to evaluate printed circuit board design features to improve outgassing under bottom terminated components. Bottom terminated components have notoriously low standoff gaps.

Uses

Solder Paste Characterization

Activity of Flux Residue

No-Clean Soldering

Cleaning under QFNs

Components

MGX QFN 48-1 Chip

MGX QFN 48-1 Chip

MGX QFN 48-1 Chip is one of the more challenging components to clean with a standoff gap lower than 50µms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.

0508/10 PF-480 PF Capacitor Array Chip

0508/10 PF-480 PF Capacitor Array Chip

Is a miniaturized cap with a very tight pitch between the conductors of opposite polarity. This design tests for fluid that can be trapped in the body of the component located under an RF Shield.