The pin header shunt allows the user to turn on or off one or more components across the net of components in a specific quadrant. Should you have a failure, the shunt will allow you to determine the component from which that failure occurred. The header shunt is not designed across every board. It is commonly used on custom-designed highly dense test boards.
0.230”L x 0.200 W (5.84 mm x 5.08 mm)
The MGX 20 Pin Header test board is designed to test both wave solder and selective solder processes. Each quadrant has a change in pitch from 1 mm/1.27 mm/2 mm/2.54 mm. The reduction in pitch allows the assembler to dial in their selective soldering and wave soldering processes on highly dense component geometries. This board is also capable of doing paste in-hole.
The MGX B-52 Legacy 4 test board is excellent for evaluating the design margin represented on assemblies populated with bottom terminated components. The QFN designs incorporate large thermal lugs, which can underfill the bottom termination with flux residue.