MGX BGA 10
Uses
Activity of Flux Residue
No-Clean Soldering
Cleaning under Bottom Terminated Components
Cleaning under QFNs
Components
MGX BGA 256 Chip
MGX BGA 256 is a 256 I/O array designed to be used for both BGA and LGA component designs. The 256 I/O is optimal for defining cleanliness levels under similar package styles.
MGX BGA 572 Chip
MGX BGA 572 is a 572 I/O array designed to be used for both BGA and LGA component designs. By increasing the I/O to 572, the residue set will be a more rigorous test for both clean and no-clean designs.
MGX BGA 1020 Chip
MGX BGA 1020 is a 1020 I/O array designed to be used for both BGA and LGA component designs. As the I/O increases to 1020, the package presents a greater challenge for both clean and no-clean designs.
MGX BGA 1932 Chip
MGX BGA 1932 is a 1932 I/O array designed to be used for both BGA and LGA component designs. As the I/O increases to 1932, the challenge for both clean and no-clean widens making for a worst-case condition.
0508/10 PF-480 PF Capacitor Array Chip
Is a miniaturized cap with a very tight pitch between the conductors of opposite polarity. This design tests for fluid that can be trapped in the body of the component located under an RF Shield.