Uses
Activity of Flux Residue
No-Clean Soldering
Cleaning under QFNs
Cubic Volume of Flux
Components

MGX QFN 48-11 Chip
MGX QFN 48-11 Chip is one of the more challenging components to clean with a standoff gap lower than 50μms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.

0508/10 PF-480 PF Capacitor Array Chip
Is a miniaturized cap with a very tight pitch between the conductors of opposite polarity. This design tests for fluid that can be trapped in the body of the component located under an RF Shield.