Magnalytix: Your One-Stop Shop for Custom Test Boards and Solutions
At Magnalytix, we understand that the success of your electronics manufacturing process hinges on reliable and thorough testing. That’s why we’re proud to offer a comprehensive range of test boards designed to meet your specific needs, whether you’re focused on cleanliness, solder paste characterization, outgassing, or process control. Our commitment to quality and customer satisfaction ensures that you not only get the data you need but also the expert insights to interpret and act on that data.
The B-52 Legacy 2 Board: Setting the Standard for SMT Testing
The B-52 Legacy 2 board is a cornerstone in our lineup, designed to address the critical aspects of Surface Mount Technology testing. This board is ideal for:
- Solder Paste Characterization: The B-52 Legacy 2 board is perfect for evaluating the activity of solder paste residues. In environments where moisture and humidity are present, there is a risk of flux residues mobilizing metal oxides, which can lead to current leakage. Our board allows you to assess this risk thoroughly.
- Process Development: Whether you’re working with no-clean or cleaning applications, the B-52 Legacy 2 helps you characterize solder pastes, fine-tune reflow conditions for proper flux outgassing, and validate the effectiveness of cleaning agents in removing process residues.
- Process Control: The board is essential for monitoring solder paste life, optimizing reflow profiles, and controlling flux outgassing under leadless and bottom-terminated components.
If you’re looking to develop or refine your SMT process, the B-52 Legacy 2 board offers the tools you need to ensure reliability and performance.
The BGA 10 Board: Excellence in Multi-Chip Module Evaluation
Our BGA 10 board is specifically designed for those working with Ball Grid Array (BGA) platforms and multi-chip modules. It’s particularly effective for:
- Characterizing soldering materials and assessing the risk of no-clean processes on packages with higher I/O. It’s an essential tool for evaluating low-temperature solder paste residue activity and underfill performance in temperature cycling environments.
- Secondary Uses: This board is also valuable for comparing no clean versus clean processes, particularly in low standoff BGA applications. It helps you evaluate the cleaning process and the reliability of your assemblies.
The BGA 10 board is an indispensable asset for anyone involved in high-density, multi-chip module manufacturing.
The MGX QFP 48-11 Board: Versatility in Mixed Technology Testing
The MGX QFP 48-11 board offers process versatility, making it ideal for a range of applications, including:
- SMT Top and Bottom: Perfect for testing both the top and bottom sides of SMT assemblies.
- Selective Soldering and Rework: This board is designed to evaluate mixed technology, including BTCs, SMT/TH connectors, and capacitors, making it a go-to for selective soldering and rework processes.
For manufacturers dealing with complex assemblies that require a mix of technologies, the MGX QFP 48-11 board provides the comprehensive testing capabilities you need.
The Connector Board: Selective Soldering and Rework
For those focusing selective soldering and rework processes, the MGX Connector 10 board offers critical insights into:
- Materials Characterization: Assess the effectiveness of wave soldering and selective soldering, particularly in high-density connector applications.
- Flux Migration: Evaluate the risk of flux migration to neighboring SMT components and the benign nature of flux residues in these scenarios.
- Rework Residues: Test the impact of rework residues and liquid fluxes, whether selective or manual, on your assemblies.
This board is a must-have for anyone aiming to optimize soldering processes in challenging, high-density environments.
The QFN 11 Board: Precision in Bottom Terminated Component Testing
The QFN 11 board is designed specifically for Bottom Terminated QFN testing, with applications that include:
- Solder Paste Characterization: This board is ideal for evaluating the risk of current leakage as pad distances narrow, and for studying no-clean flux outgassing.
- Cleaning Process Parameters: It helps assess cleaning effectiveness, especially under the tight pitch and small pad dimensions typical of QFN components.
If your focus is on ensuring the reliability of bottom-terminated components, the QFN 11 board provides the precise testing environment you need.
Open Comb Test Boards: Material Characterization
Our open comb test boards like the MGX B24 and MGX B53 offer comprehensive testing capabilities for:
- Solder Paste Characterization
- Cleaning Process Evaluation
- Flux Outgassing Studies
Custom Solutions: Tailored to Your Needs
Even if none of these boards resemble your custom boards, we would be more than happy to engineer a specific board just for you. Our team can work with you to design a board that meets your exact specifications, complete with Gerber files, so you can achieve the testing outcomes you need.
Conclusion
At Magnalytix, we’re committed to being your one-stop shop for all your testing needs. Whether you’re looking to characterize solder pastes, validate cleaning processes, or assess the reliability of complex assemblies, we have the test boards and expertise to help you succeed. With our extensive range of boards and custom engineering capabilities, we’re here to ensure that your testing process is as efficient and effective as possible. Let us help you develop a DOE plan, qualify your processes, and achieve the data-driven insights you need to maintain the highest standards of reliability in your manufacturing operations.