Functional Surface Insulation Resistance (SIR) Testing

Testing both Functional and SIR Circuits allows for the process to be qualified to assess acceptable levels of flux and process residues. Functional-SIR testing using the Umpire 41 test system is representative of actual production assembly.


Overview

The Umpire 41® Functional-SIR Test Board is designed to develop Objective Evidence per IPC J-STD-001J and IPC-A-610 to Qualify the assembly process to ensure acceptable levels of flux residues and process contamination. The test instrumentation, in combination with the Umpire 41, allows for electrical testing in temperature, humidity, and bias conditions using electrical active and SIR components.

Surface Insulation Resistance (SIR) testing evaluates the long-term reliability of electronic materials and processes by exposing circuits to controlled temperature, humidity, and electrical bias to identify potential failure mechanisms caused by electrochemical reactions. It assesses production process chemistries such as solder masks, flux, paste, and wire, as well as assembly processes like reflow, SMT parameters, and cleaning methods. High-temperature and humidity aging tests simulate years of service in days, providing critical insights into material integrity and reliability. With tailored test profiles, SIR testing helps predict service life, ensuring quality and durability in electronic assemblies.

Electric systems, hardware, harnesses, and individual circuit board cleanliness have become critical aspects of electronic hardware reliability. Cleanliness of electronic hardware has historically been identified by general visual conditions, particles and debris, and the general conductivity average of a solvent after exposure of the entire circuit board. Still, these general tests have not proven to correlate to predictive hardware.

The Umpire 41 test board assessment, offered in collaboration with testing from Foresite and Magnalytix reliability test labs, addresses the cumulative and interactive effects of the electronic assembly process.

Why Choose This Test?

  • Tests sensitive circuits
  • Tests circuits pad to pad, via to hole, and lead to lead
  • Tests for what residues are present and their impact on circuit performance
  • Tests multiple processes (SMT- Selective – Manual)
  • Tests for collective residues across the assembly
  • Tests for the collective impact of residues both applied and removed

Industries Served

Aerospace & Defense
Automotive Electronics
Medical Devices
Telecommunications
Consumer Electronics
Industrial Equipment
Advanced Packaging
Artificial Intelligence
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