Magnalytix, providing real-time reliability solutions for electronics manufacturing, is proud to announce that Dr. Mike Bixenman will present the technical paper “Methods used to Qualify Soldering and Cleaning Materials and Processes” on Tuesday, March 18 at the 2025 IPC APEX EXPO Technical Conference.
Chemical failures in electronics are typically the result of interactions between materials and their environment. Contaminants can originate from manufacturing processes, such as No-Clean flux residues, partially cleaned flux residues, and wash fluids not fully rinsed during cleaning. These contaminants interact with their environment leading to the deterioration of components, ultimately causing system malfunctions.
Testing methodologies, such as Surface Insulation Resistance (SIR), Ion Chromatography (IC), and C3 testing, are designed to identify potential failure points and ensure electronic systems can withstand the challenges of different environments. Bixenman’s research paper will provide insight into the effects of process contamination and the use of these methods to qualify the assembly process.
Bixenman’s presentation, “Methods used to Qualify Soldering and Cleaning Materials and Processes” will be one of four presentations during the “Quality and Reliability 2: Ionic Process Residues and PCB Assembly Humidity Robustness” session.
Additional presentations during the session are: “From the Corrosion to Short Circuiting in Electronics: Investigation of The Detrimental Dendrite Development” presented by Dr. Kapil Kumar Gupta of Technical University of Denmark, “Investigating the Interplay of Ionic Process Contamination and PCBA Component Design on Water Layer Formation and PCBA Humidity Robustness” presented by Dr. Rajan Ambat of Technical University of Denmark, and “Understanding the Crucial Role of Solder Flux Chemistry in Enhancing Humidity Robustness of Electronics” presented by Dr. Anish Rao Lakkaraju of the Center for Electronic Corrosion (CELCORR).