Detailed Card Description
| QUADRANT 1 – Contains QTY 4 of P/N QFN48T.5-F-ISO (48-Leads, Body 7x7mm, Pitch 0.5mm) |
| QUADRANT 2 – Contains QTY 1 of P/N FBGA 244 (244-Leads WG, Body 19x19mm, Pitch 1mm) |
| QUADRANT 3 – Contains QTY 1 of P/N QFP80 (80-Leads, Body 14x14mm, Pitch 0.65mm) |
| QUADRANT 4 – Contains QTY 1 of P/N QFP160 (160-Leads, Body 28x28mm, Pitch 0.65mm) |
SIR Test Parameters
| QUADRANT 1 EDGE PIN 1 = ODD PADS EDGE PIN 2 = EVEN PADS + GND LUG |
| QUADRANT 2 EDGE PIN 3 = ODD ROW PADS + GND LUG EDGE PIN 4 = EVEN ROW PADS |
| QUADRANT 3 EDGE PIN 5 = EVEN PADS EDGE PIN 6 = ODD PADS EDGE PIN 7 = UPPER COMB BUS EDGE PIN 8 = LOWER COMB BUS |
| QUADRANT 4 EDGE PIN 5 = EVEN PADS EDGE PIN 6 = ODD PADS EDGE PIN 7 = LEFT COMB BUS EDGE PIN 8 = RIGHT COMB BUS |
Uses
| IPC J-STD-001 H |
| Activity of Flux Residue |
| Materials Characterization |
| Solder Mask Characterization |
| Conformal Coating Characterization |
| Wash Fluid Entrapment |
| Clean vs Partial Cleaning |
| Bath Life |
| Rinsing |
| Bottom Termination |
| SIR Comb Under the Component |
| BGA |
| Tight Pitch |