Test Card Descriptions
The MGX B-52 Legacy 1 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. One of the unique features of these test boards is the QFP 160 and QFP 80 SIR comb patterns placed underneath these components. These combs allow the assembler to detect bath loading and rinse issues within the cleaning process.
The MGX B-52 Legacy 2 SIR test board evaluates the activity of flux residue at both the I/O and under component terminations. MGX B-52 Legacy 2 is used to characterize solder paste, process development, and process control. The B-52 Legacy 2 card is one of our most popular test cards.
The MGX B-52 Legacy 4 test board is excellent for evaluating the design margin represented on assemblies populated with bottom terminated components. The QFN designs incorporate large thermal lugs, which can underfill the bottom termination with flux residue.
The MGX FE 10 test board was designed to emulate vented power devices for testing non-hermetically sealed components. This board is effective at evaluating rinsing effects as well as cleaning fluids that can be trapped in non-hermetically sealed components.
MGX BGA 10 SIR test board is effective at evaluating multi-chip modules and processing chips. The BGA platform enables chip makers to characterize solder pastes, low temperature solders, and underfills.
MGX Connector 10 SIR test board allows an assembler to evaluate multiple soldering steps on surface mount caps on the top and bottom side with a high-density SMT/TH connector. The MGX Connector 10 allows an assembler to test no-clean processing across multiple soldering steps including Surface Mount, Thru-Hole and Rework.
The MGX QFN 10 SIR test board is designed to evaluate printed circuit board design features to improve outgassing under bottom terminated components. Bottom terminated components have notoriously low standoff gaps.
The MGX QFN 11 SIR test board reduces signal pin pitch over the four quadrants. As the signal pin distance between opposite conductors narrows, the potential for current leakage increases. The tighter pitch equates to increases in the cubic volume of flux residue.
The MGX 9/8/7/6 system validation board is populated with four known value resistors. Its purpose to confirm or “validate” that the system is reading the proper resistance values prior to commencing a new test. This card is designed to run at ambient conditions and is recommended for use prior to the beginning of an SIR test protocol. The system software includes a software checklist/protocol to quickly validate the system, as well as record and report the results along with SIR test that commences after the validation test. Some clients elect to run the test both before and after a SIR protocol.
The MGX B-53 Type I test board contains No-Solder Mask. The four combs have varying pitch: Channel A has 500 µms spacing – Channel B has 400 µms spacing – Channel C has 320 µms spacing and Channel D has 200 µms spacing. As the pitch tightens, process residues left behind can be more problematic.
The MGX B-53 Type II test board is a Solder Mask Defined board. The four combs have varying pitch. Channel A has 500 µms spacing – Channel B has 400 µms spacing – Channel C has 320 µms spacing and Channel D has 200 µms spacing. A solder mask defined test board provides insulation between the comb patterns. This insulation provides a degree of protection from process residues.
The MGX B-53 Type III test board is a Solder Mask Defined board with Solder Mask over the SIR Comb patterns. This board is designed to use the Solder Mask specific to your designs. The board design evaluates insulation resistance of the Solder Mask place over circuit traces.
The MGX B-54 test board – similar in design to the IPC B-25A test board. MGX B-54 is used to evaluate interactions between solder masks, solder pastes, and solder fluxes. MGX B-54 is functional at testing the current requirements for Conformal Coatings (IPC-CC-830A).
The MGX 20 Pin Header test board is designed to test both wave solder and selective solder processes. Each quadrant has a change in pitch from 1 mm/1.27 mm/2 mm/2.54 mm. The reduction in pitch allows the assembler to dial in their selective soldering and wave soldering processes on highly dense component geometries. This board is also capable of doing paste in-hole.
The MGX B-24 Type I test board is representative of the IPC B-24 test board design to characterize solder materials and cleanliness. The test patterns are exposed to an accelerating test environment of temperature and humidity under bias to measure Surface Insulation Resistance (SIR Leakage Currents) between two metal electrodes.