MGX QFP 80 Chip

Detailed Component Description

(80-Leads, Body 18.3×18.3 mm, Pitch 0.65 mm)
MGX QFP 80 is a challenging component due the 0.65 mm pitch and large pad size of 0.45 mm by 1.8 mm and SIR comb under the component termination. Unlike the leaded component, the lands are screen printed around the peripheral of the part. These components are excellent to detecting cleaning and rinsing issues.