Components

Component Description

(48-Leads, Body 7.8×7.8 mm, Pitch 0.5 mm)
MGX QFN 48 has a smaller thermal lug of 4 mm squared designed to define cleanliness levels under similar package styles.

(48-Leads, Body 7×7 mm, Pitch 0.5 mm)
MGX QFN 48-1 Chip is one of the more challenging components to clean with a standoff gap lower than 50μms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.

(48-Leads, Body 7.25×7.25 mm, Pitch 0.5 mm)
MGX QFN 48-11 Chip is one of the more challenging components to clean with a standoff gap lower than 50μms, flux residues bridge the lands and thermal lug. The residues tend to be active due to poor outgassing channels.

(88-Leads, Body 12.6×12.6 mm, Pitch 0.5 mm)
MGX QFN 88-1 Chip is a larger QFN with 88 signal pins and 10.5 mm squared thermal lug designed to define cleanliness levels under similar package styles.

(124-Leads, Body 10.4×10.4 mm, Pitch 0.5 mm)
MGX QFN DR 124-1 Chip is a dual row QFN with 124 signal pins and large 7 mm squared ground lug designed to define cleanliness levels under similar package styles.

(244-Leads, Body 19×19 mm, Pitch 1 mm)
With a center lug, MGX BGA 244 has a high standoff gap and easier to clean. This component tends to be representative of the BGA family of components. The center lug adds some degree of complexity by obstructing flow channels.

(256-Leads, Body 17×17 mm, Pitch 1mm)
MGX BGA 256 is a 256 I/O array designed to be used for both BGA and LGA component designs for defining cleanliness levels under similar package styles.

(572-Leads, Body 25×25 mm, Pitch 1 mm)
MGX BGA 572 is a 572 I/O array designed to be used for both BGA and LGA component designs for defining cleanliness under similar package styles.

(1020-Leads, Body 33×33 mm, Pitch 1 mm)
MGX BGA 1020 is a 1020 I/O array designed to be used for both BGA and LGA component designs for defining cleanliness under similar package styles.

(1932-Leads, Body 45×45 mm, Pitch 1 mm)
MGX BGA 1932 is a 1932 I/O array designed to be used for both BGA and LGA component designs for defining cleanliness under similar package styles.

(80-Leads, Body 18.3×18.3 mm, Pitch 0.65 mm)
MGX QFP 80 is a challenging component due the 0.65 mm pitch and large pad size of 0.45 mm by 1.8 mm and SIR comb under the component termination. Unlike the leaded component, the lands are screen printed around the peripheral of the part. These components are excellent to detecting cleaning and rinsing issues.

(80-Leads, Body 17.5×17.5 mm, Pitch 0.65 mm)
MGX QFP 80-1 is representative of the leaded QFN 80 components with smaller pad size of 0.25 mm by 1.0 mm and SIR comb under the component termination. This component is designed to detect cleaning and rinsing issues.

(160-Leads, Body 32.5×32.5 mm, Pitch 0.65 mm)
MGX QFP 160 is a challenging component due the 0.65 mm pitch and large pad size of 0.45 mm by 2 mm and SIR comb under the component termination. Unlike the leaded component, the lands are screen printed around the peripheral of the part. These components are excellent to detecting cleaning and rinsing issues.

(160-Leads, Body 31.8×31.8 mm, Pitch 0.65 mm)
MGX QFP 160-1 is representative of the leaded QFN 80 components with smaller pad size of 0.3 mm by 1.0 mm and SIR comb under the component termination. This component is designed to detect cleaning and rinsing issues.

(64-Leads, Body 33×6.6 mm, Pitch 1 mm)
MGX Custom 64 SMT is representative of surface mount connectors. The large pad dimensions of 0.36 mm by 2.2 mm can trap process residues pin to pin. This component is designed to define cleanliness levels on similar connector designs.

(40-Leads, Body 26.7×8.4 mm, Pitch 1.27 mm)
MGX SMT TH-40 Pin is representative of a surface mount and thru-hole connector. This is a challenging component due to the large SMT pad size 0.5 mm by 2 mm. In addition, the wave or selective flux can wet through the barrel and intermix with the SMT flux.

0.039”L x 0.020 W (1.00 mm x 0.50 mm)
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The caps are excellent for characterizing both cleaned and No-Cleaned process residues under similar component styles.

0.063”L x 0.031”W (1.60 mm x 0.80 mm)
Are common on all circuit designs. These caps have low standoff gaps under 50µms. The caps are excellent for characterizing both cleaned and No-Cleaned process residues under similar component styles.

0.079”L x 0.049”W (2.00 mm x 1.25 mm)
Are common on all circuit designs. These caps have low standoff gaps under 50μms. The caps are excellent for characterizing both cleaned and No-Cleaned process residues under similar component styles.

0.126”L x 0.063”W (3.20 mm x 1.60mm)
Is representative of capacitor caps that exhibit a low standoff gap. This component is designed to characterize both cleaned and No-Cleaned process residues under similar component package styles.

0.024”L x 0.012”W (0.60 mm x 0.30 mm)
Is representative of capacitor caps that exhibit a low standoff gap. This component is designed to characterize both cleaned and No-Cleaned process residues under similar component package styles.

0.230”L x 0.200 W (5.84 mm x 5.08 mm)
The pin header shunt allows the user to turn on or off one or more components across the net of components in a specific quadrant. Should you have a failure, the shunt will allow you to determine the component from which that failure occurred. The header shunt is not designed across every board. It is commonly used on custom-designed highly dense test boards.

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